? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 page 1 of 7 SM8030 optically coupled dual mosfet drive r w/discharge circuit description the SM8030 is composed of two distinct mosfet drivers in a single package. each driver circuit consists of an input drive led optically coupled to a photodiode array output designed to drive highly capacitive loads, including the gate of a power mosfet. the active discharge circuit of the pdas assures quick discharge of mosfets, providing fast turn-off times. this device can be used as two separate drivers, or can be wired as a single enhanced driver with either greater photo current or photo voltage output. the SM8030 comes standard in a compact 8 pin dip package making it ideal for high-density board applications. schematic diagram agency approvals ul/c-ul: file # e201932 vde: file # 40035191 (en 60747-5-2) applications ? isolated means to drive discrete power mosfets ? lighting controls ? process control modules ? solid state relays ? solenoid controls absolute maximum ratings the values indicated are absolute stress ratings. functional operation of the device is not implied at these or any conditions in excess of those defined in electrical characteristics section of this document. exposure to absolute maximum ratings may cause permanent damage to the device and may adversely affect reliability. storage temperature ??????????..-55 to +125c operating temperature ? ..?.?.??...???-40 to +85c continuous input current ???..????????..50ma transient input current ???..???.?????..400ma reverse input control voltage ????..???????5v input power dissipation ???..?????????40mw output power dissipation ??..????????..400mw solder temperature ? wave (10sec)??????.?.260c solder temperature ? ir reflow (10sec)?.????..260c ordering information part number description SM8030 8 pin dip, (50/tube) SM8030-h 5kv rms viso, 8 pin dip, (50/tube) SM8030-s 8 pin smd, (50/tube) SM8030-hs 5kv rms , 8 pin smd, (50/tube) SM8030-str 8 pin smd, tape and reel (1000/reel) SM8030-hstr 5kv rms , 8 pin smd, tape and reel (1000/reel) note: suffixes listed above are not included in marking on device for part number identification features ? compact 8 pin dip/smd package ? built in active discharge circuit for fa st turn-off ? fast turn-on ? optional parallel or serial output connections ? 12v gate drive voltage ? high input-to-output isolation (up to 5kv rms ) ? long life / high reliability ? rohs / pb-free / reach compliant SM8030
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 2 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit parameter symbol min. typ. max. units test conditions input specifications led forward voltage v f - 2.8 3.5 v i f = 10ma led reverse voltage bv r 5 - - v i r = 10 a reverse leakage current i inrleak - - 10 ? a v r = 5v turn-on current i f - 5 10 ma v out = 5v turn-off current i f(off) - 0.5 - ma v out = 2v output specifications open circuit voltage v oc 12 14 - v i f = 10ma short circuit voltage i sc 20 25 - ? a i f = 10ma isolation specifications isolation voltage v iso 3750 - - v rms rh 50%, t=1min (-h option) 5000 - - input-output resistance r i-o - 10 12 - ?? v i-o = 500v dc electrical characteristics, t a = 25c (unless otherwise specified)
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 3 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit process step description parameter a preheat start temperature (oc) 150oc b preheat finish temperature (oc) 180oc c preheat time (s) 90 - 120s d melting temperature (oc) 230oc e time above melting temperature (s) 30s f peak temperature, at terminal (oc) 260oc g dwell time at peak temperature (s) 10s h cool-down (oc/s) <6oc/s SM8030 solder temperature profile recommendations (1) infrared reflow: refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. soldering process should not exceed temperature or time limits expressed herein. su rface temperature of device package should not exceed 250oc: a b c d f e g h (2) wave solder: (3) hand solder: maximum temperature: 260oc (at terminal) maximum time: 10s pre-heating: 100 - 150oc (30 - 90s) single occurrence maximum temperature: 350oc (at tip of soldering iron) maximum time: 3s single occurrence figure 1
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 4 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit SM8030 package dimensions 8 pin dip package note: all dimensions in inches [?] with millimeters in parenthesis ()
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 5 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit SM8030 package dimensions 8 pin smd surface mount package (-s) note: all dimensions in inches [?] with millimeters in parenthesis ()
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 6 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit 8 pin smd tape & reel (-str) note: all dimensions in millimeters SM8030 package dimensions
? 2013 solid state optronics ? san jos, ca www.ssousa.com ? +1.408.293.4600 page 7 of 7 SM8030 /h/s/tr rev 2.00 (11/12/2013) 001731 SM8030 optically coupled dual mosfet drive r w/discharge circuit note: all weights above are in grams, and include packaging materials where applicable device single unit full tube (50pcs) full pouch (10 tubes) full reel (1000pcs) SM8030(-h) 0.54 43 450 - SM8030-(h)s 0.53 42 440 - SM8030-(h)str 0.53 - - 952 solid state optronics (sso) makes no warranties or representations with regards to the completeness and accuracy of this docume nt. sso reserves the right to make changes to product description, specifications at any time without further notices. sso shall not assume any liability arising out of the application or use of any product or circui t described herein. neither c ircuit patent licenses nor indemnity are expressed or implied. except as specified in sso?s standard te rms & conditions, sso disclaims liability fo r consequential or other damage, and we mak e no other warranty, expressed or implied, including merchantability and fitness for particular use. disclaimer sso does not authorize use of its devices in life support applicat ions wherein failure or malfunc tion of a device may lead to p ersonal injury or death. users of sso devices in life support applications assume all risks of such use and agree to indemnify sso against any a nd all damages resulting from such use. life s upport devices are defined as devices or syst ems which, (a) are intended for surgical i mplant into the body, or (b) support or sustain life, and (c) whose failure to per form when used properly in accordance with instructions for u se can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support devic e or system, or to affect its safety or effectiveness. life support policy SM8030 package marking SM8030 package weights date code pin 1 SM8030 yyww
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